STM32F103CBT6 Alternatives: 128 KB Flash MCU Guide
The same die, the same 48-pin footprint, twice the flash — and the firmware work most people forget before they swap.
Read articleCouldn't load pickup availability
150MHz SRAM 1 150MHz 1.8V, 3V I2C, I2S, MMC, SD, SPI, SSI, UART ARM920T MAPBGA-225 surface mount 13 × 13 mm (body), 1.25–1.60 mm height
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer Part Number | MC9328MXLVP15 |
| IC Category | Application Processors & SoC |
| Package | 225-MAPBGA / 225-LFBGA (13 × 13 mm) |
| Lifecycle Status | Active |
150MHz SRAM 1 150MHz 1.8V, 3V I2C, I2S, MMC, SD, SPI, SSI, UART ARM920T MAPBGA-225 surface mount 13 × 13 mm (body), 1.25–1.60 mm height
| Supply Voltage | 1.8V |
|---|---|
| Frequency | 150MHz |
| Package | 225-MAPBGA / 225-LFBGA (13 × 13 mm) |
| Peripherals | I2C, SPI, UART, I2S, MMC, SSI |
| Dimensions | 13mm × 13mm |
Inventory and pricing are updated regularly. Technical data is provided for engineering reference.
MC9328MXLVP15 uses a 225-MAPBGA package (also described as 225-LFBGA), with a 13 × 13 mm body, 225 solder balls in a 15 × 15 array, and 0.8 mm ball pitch. Package height is 1.25–1.60 mm. NXP case outline: 1304B-01. Mounting: surface mount (SMT).
Source: NXP MC9328MXL Technical Data, Rev. 8, Section 5.2, Figure 68, page 87.
MANUFACTURER ACCESS
Browse frequently requested semiconductor and electronic component manufacturers, then search the catalog or submit an RFQ for the exact part you need.
From the desk
Market signals, technical notes, and practical sourcing guidance for semiconductor procurement.
The same die, the same 48-pin footprint, twice the flash — and the firmware work most people forget before they swap.
Read article
The one-amp linear charger on millions of USB boards: what to match, what to add for safety, and when a linear charger is the wrong choice.
Read article
Seven channels, built-in clamp diodes, and a pinout that has not changed in forty years — what to check before you substitute one.
Read article
The 8 MB SPI flash behind a million embedded designs: package traps, firmware checks, and when 64 Mbit is still the right density.
Read article
The 16-pin transceiver that turns 3.3 V logic into RS-232: which parts really fit, and why the charge-pump capacitors decide the outcome.
Read article
The three-terminal regulator on millions of boards: which parts really fit, and why the thermal math matters more than the pinout.
Read article
A 3 A buck converter that refuses to die: which replacements fit the same pads, which need a new layout, and how to choose between them.
Read article
The 48-pin Cortex-M3 that became an industry default: which alternatives really fit, and what breaks when you swap one in.
Read article