HDMI and DisplayPort: A Practical Introduction
Before pixels, the source needs HPD and EDID. Lanes, AC coupling, DDC/AUX and the sideband failures behind most no-signal reports.
Read articleBrand: CHILISIN
Chilisin Electronics Corporation
Chilisin was founded in 1972 with deep R&D and marketing experience, and has developed its own powder technology, making it one of the few inductor suppliers capable of manufacturing magnetic cores in-house. In recent years, the company has expanded through strengthened independent R&D, efficient automated production processes, and acquisitions. Through vertical and horizontal integration from powder and magnetic cores to production processes, Chilisin has earned recognition from many global players in markets such as data centers, mobile devices, consumer electronics, and communication systems, while targeting high-end automotive electronics and industrial applications with product characteristics such as high quality and high performance.
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Recent Articles
Market signals, technical notes, and practical sourcing guidance for semiconductor procurement.
MOSFET Selection: VDS, RDS(on), Qg, and Thermal
Most MOSFET choices fail on the second or third number. Voltage margin, on-resistance at your real gate drive, gate charge, and the package thermal path.
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PCN and EOL Management: Notice to Last-Time Buy
A change notice is a deadline. How to classify what it touches, decide on re-qualification, size the last-time buy, and keep a record that survives the...
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74HC595 Segment Drive: Current Limits and Heat
A 74HC595 is a logic driver, not an LED driver: 35 mA is a damage threshold, 6 mA is the design point, and eight segments add...
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How to Prepare a BOM for Electronic Component Sourcing: 12 Essential RFQ Fields
An accurate BOM is the starting point for a reliable electronic component quotation. Learn how EMS, PCBA, and OEM procurement teams can prepare better RFQs with...
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USB-C and SuperSpeed: A Practical Introduction
USB-C is a connector, not a speed. CC roles, PD power, 85 ohm SuperSpeed pairs and the five mistakes that stop a port from working.
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STM32F103RBT6 to RET6: Flash Density Migration Guide
Check pinout, flash page size and SRAM before moving a design from STM32F103RBT6 to the higher-density RCT6 or RET6 in the same LQFP64 footprint.
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Buck Converter Layout: Hot Loop, Switch Node, Copper
The schematic sets efficiency; the layout sets temperature. Hot loop, input capacitor ripple, switch-node ringing, thermal vias, and the loss budget that decides the copper.
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